Tape-automated bonding
（重定向自Tape automated bonding）
![Description](/Images/godic/202502/15/Tape-automated_bonding_carrier.svg0859.png")
Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.