| 释义 |
cooling of semiconductor devices by using heat of fusion
- 半导体器件bàn dǎo tǐ qì jiàn
semiconductor device; semiconductor apparatus
- 利用lì yòng
using, utilize, make use of, avail oneself of, impose
- 渐废jiàn fèi
fall out of use, fell out of use, get out of use, went out of use
- 借助jiè zhù
by dint of, in virtue of
- 开始不用kāi shǐ bú yòng
fall out of use, get out of use, got out of use
- 热功当量rè gōng dāng liàng
mechanical equivalent of heat; heat equivalent of work
- 很有用hěn yǒu yòng
of great use
- 散热sàn rè
heat dissipation; rejection of heat; radiating
- 借助于jiè zhù yú
recur to; by means of; with the help of; with the aid of; by feat of
- 迫于pò yú
by force of
- 取道qǔ dào
by way of
- 煦育万物xù yù wàn wù
make all things grow by action of heat
- 无济于事wú jì yú shì
of no help, of no use
- 借jiè
borrow; lend; use as a pretext; make use of; take advantage of (an opportunity, etc.)
- 无补wú bǔ
of no help, of no use
- 搅拌热jiǎo bàn rè
heat of stirring
- 膨润热péng rùn rè
heat of swelling
- 燃烧热rán shāo rè
heat of combustion
- 聚变jù biàn
fusion
- 油冷yóu lěng
oil cooling
- 假道jiǎ dào
by way of, via
- 途经tú jīng
by way of; via.
- 作为zuò wéi
by way of, qua
- 济事jì shì
be of use
- 嫡堂dí táng
of the same grandfather by the direct line
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