表面安装技术（又称为SMT, Surface-mount technology），是一种电子装联技术，起源于60年代，最初由美国IBM公司进行技术研发，之后于80年代后期渐趋成熟。此技术是将电子组件，如电阻、电容、晶体管、集成电路等等安装到印刷电路板上，并通过钎焊形成电气联结。其使用之组件又被简称为SMD（surface-mount devices）。和插入式封装（through-hole technology）的最大不同处在于，表面安装技术不需为组件的针脚预留对应的贯穿孔，而表面安装技术的组件尺寸也比插入式封装的微小许多。

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.