Reflow soldering
（重定向自Infrared Soldering）
![Example of reflow soldering thermal profile.](/Images/godic/202501/20/RSS_Components_of_a_Profile1.svg2517.png")
![A graphical example of a reflow oven.](/Images/godic/202501/20/Mark5_1826_Reflow_Oven2517.jpg")
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.