| 释义 | 
             
                interparticle bonding
                
            耦合力ǒu hé lì 
 bonding force芯片焊接xīn piàn hàn jiē 
 chip bonding; die bonding; die attachment缝焊féng hàn 
 slit bonding键合jiàn hé 
 bonding; linking; linkage交联jiāo lián 
 crosslinking; cross bonding芯片焊盘xīn piàn hàn pán 
 chip bonding pad粘合zhān hé 
 conglutinate; glue; adhesion; bonding; cohere担保公司dān bǎo gōng sī 
 bonding company; guarantee company焊接周期hàn jiē zhōu qī 
 welding interval; bonding cycle; weld cycle; welding cycle
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