集成电路封装（英语：integrated circuit packaging），简称封装，是半导体器件制造的最后阶段，之后将进行集成电路性能测试。器件的核心晶粒被封装在一个支撑物之内，这个封装可以防止物理损坏（如碰撞和划伤）以及化学腐蚀，并提供对外连接的引脚，这样就便于将芯片安装在电路系统里。

芯片的封装通常需要考虑引脚的配置、电学性能、散热和芯片物理尺寸方面的问题。半导体业界内有多种典型的封装形式：

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.